Product Description
GABIONS (Greater than 1' in height) and MATTRESSES (Less than 1' in height) consist of rectangular units, fabricated from a double-twisted hexagonal mesh. Filled with stones, gabions become large, flexible and permeable elements from which a broad range of structures may be built.
GABIONS or MATTRESSES are divided into cells with diaphragms (usually spaced at 1 meter or 3' intervals), whose function is to reinforce the structure. The mesh (except for the diaphragms) is reinforced on all edges with wires of a larger diameter to strengthen the gabions and facilitate the assembly and installation.
> Hot-dip galvanized, ( Zinc coating: 50g/m2)
> Heavy Hot-dip galvanized, ( Zinc coating: Min 240g/m2)
> Galfan Coating, (Zn - 5Al - MM coating)
>Electro Galvanized +PVC Coated, Hot-dip galvanized+PVC Coated, Heavy Hot-dip galvanized +PVC Coated.
> Galfan coating +PVC Coated.
All kinds of colors can be coated according to customers' special requires
| Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Gabion Cage / Box | |||
| Wire Mesh (mm) |
Galvanized Wire Thickness (mm) |
PVC Coated Wire Thickness (mm) |
Overall Size (M) |
| 60x80 | 2.0-2.8mm | 2.0/3.0--2.5/3.5mm | 2x1x1 3x1x1 3x2x1 4x1x1 4x2x1 5x2x1 6x1x1 6x2x1 |
| 80x100 | 2.0-3.2mm | 2.0/3.0--2.8/3.8mm | |
| 80x120 | 2-3.2mm | 2.0/3.0--2.8/3.8mm | |
| 100x120 | 2-3.4mm | 2.0/3.0--2.8/3.8mm | |
| 100x150 | 2-3.4mm | 2.0/3.0--2.8/3.8mm | |
| 120x150 | 2.0-4.0mm | 2.0/3.0--3.0/4.0mm | |
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Blister copper (content of 99% copper) was prepared in advance as a thick plate, pure copper flakes as a cathode, with sulfuric acid (H2SO4) and copper sulfate (CuSO4) mixture as electrolyte. After power is applied, copper dissolves from the anode into copper ions (Cu) and moves to the cathode. Upon reaching the cathode, electrons are obtained and pure copper (also called electrolytic copper) precipitates at the cathode. Blister copper impurities in lively copper and zinc with copper will be dissolved as ions (Zn and Fe). Since these ions are more difficult to precipitate than copper ions, electrolysis can be avoided by appropriately adjusting the potential difference during electrolysis. Than the inactive copper impurities such as gold and silver deposition in the bottom of the cell. The copper plate so produced is called "Pure Copper Sheet (T2)" and of high quality and can be used to make electrical products. Sedimented in the bottom of the cell analogy as "anode mud", which is rich in gold and silver, is a very valuable object, remove and then processed with high economic value.
Pure Copper Sheet (T2)
Pure Copper Sheet,Pure Copper Plate,High Pure Copper Sheet,Pure Cathode Copper Sheet
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