Abstract The first generation of semi-conductive material Si ignited the "star fire" of information industry development, and Si material chip also achieved the "Silicon Valley" high-tech industrial cluster, which prompted the birth of world semiconductor giants such as Intel...
The first generation of semi-conductive material Si ignited the "star fire" of information industry development, and Si material chip also achieved the "Silicon Valley" high-tech industrial cluster, which prompted the birth of world semiconductor giants such as Intel, more than 95% of semiconductor devices. And more than 99% of integrated circuits are made of Si materials. At present, 40% of the world's energy is consumed as electrical energy, and the maximum dissipation of electrical energy conversion is a semiconductor power device. The former "mainstay" Si power device has become the material limit of its development, and it is difficult to meet the new demands of today's society for high frequency, high temperature, high power, high energy efficiency, harsh environment and light weight. The third-generation semiconductor materials represented by SiC will become a breakthrough with its excellent properties and are rapidly emerging.
As a wide bandgap semiconductor material, SiC not only has high breakdown electric field strength, good thermal stability, but also has high carrier saturation drift speed and high thermal conductivity. It can be used to manufacture various high temperature resistant high frequency. High-efficiency, high-power devices for applications where Si devices are difficult.
The third-generation semiconductor materials represented by SiC and the like will be widely used in optoelectronic devices, power electronic devices, etc., and their excellent semiconductor performance will play an important innovation role in various modern industrial fields, with great application prospects and market potential. .
LED semiconductor lighting is the first breakthrough achieved by the third generation of semiconductor technology represented by SiC! SiC effectively solves the lattice matching problem between the substrate material and GaN, reduces defects and dislocations, and higher electro-optical conversion efficiency fundamentally brings more light emission and less heat dissipation. Based on this, 303 lm / W high-power LED laboratory light efficiency record was born, high-density LED technology can achieve smaller size, higher performance, more flexible design of LED lighting system, groundbreaking SC5 technology platform and large Power XHP LED devices enable up to 40% cost reduction in LED lighting systems.
As the cost of SiC production decreases, SiC semiconductors are gradually replacing Si semiconductors with their excellent properties, breaking the bottleneck of Si-based properties due to the properties of the materials themselves. Undoubtedly, it will trigger an industrial revolution similar to a steam engine:
1. SiC material is applied in the field of high-speed rail, which can save more than 20% energy and reduce the volume of power system;
2. SiC materials are used in the field of new energy vehicles, which can reduce energy consumption by 20%;
3. SiC materials are used in the field of home appliances, which can save 50% energy;
4. SiC materials are used in the field of wind power generation, which can increase efficiency by 20%;
5. SiC materials are used in the field of solar energy, which can reduce the photoelectric conversion loss by more than 25%;
6. SiC materials are used in the field of industrial motors, which can save energy by 30%-50%;
7. SiC materials are used in the field of ultra-high voltage DC transmission and smart grid, which can reduce power loss by 60% and increase power supply efficiency by more than 40%;
8. SiC materials are used in the field of big data to help significantly reduce energy consumption in data centers (currently 3 million data centers worldwide consume about 30 million kilowatts per hour);
9. SiC materials are used in the field of communications, which can significantly improve signal transmission efficiency and transmission security and stability;
10. SiC materials can reduce the loss of equipment by 30%-50%, the operating frequency is 3 times higher, the capacitance and capacitance are reduced by 3 times, and the weight of the radiator is greatly reduced.
At the beginning of 2014, US President Barack Obama personally led the establishment of the third generation of the bandgap semiconductor industry alliance represented by SiC. Behind this move is the strong support of the US for the third generation of the wide bandgap semiconductor industry represented by SiC semiconductors. It is understood that this industry has now received a total of 140 million US dollars in support from the US federal and local governments. As early as 2013, the Japanese government incorporated SiC into the “Prime Minister Strategyâ€, arguing that 50% of energy conservation in the future will be achieved through it, creating a new era of clean energy.
As US President Barack Obama mentioned at the inaugural meeting of the industry alliance, the third-generation semiconductor technology represented by SiC will reduce the size of notebook adapters by 80%, and can also reduce the size of a substation to a suitcase. Size specifications. Perhaps this is where the charm of SiC semiconductors lies.
In the future, power devices made of semiconductor SiC materials will support the development trend of today's energy-saving technologies and become the core components of energy-saving equipment. Therefore, semiconductor SiC power devices are also known as "CPU" and green economy of power converters. "core".
Hand Applied Wrapping Machine
The Hand Applied wrapping machine is a lightweight, low profile pipe wrapping machine that provides a simple way to apply tape coatings on pipelines. It can be used on any pipe 4" or larger and can accommodate tape with a core diameter of 1 1/2 or 3 inches. It can easily be used for either spiral or cigarette wrapping and is designed with separate tension adjustments for tape and release line take-up. This machine should be ordered by the width of the tape and not the diameter of the pipe.
Details:
· Hand Applied Wrapping Machine
· Applies tape coatings on pipelines
· Separate tension adjustments for tape and release line take-up
· Will accommodate tape with 1-1/2" or 3" core diameters
· Ideal for both spiral and cigarette wrapping
· It can be used on any pipe 4" and Larger
· Very low profile, requires less clearance
· Lightweight construction
· Easy to operate
· Order these machines by the width of your tape roll – NOT the diameter of the pipe:
· 2"-6" tape roll width
· 6"-12" tape roll width
· 12"-18" tape roll width
Weight: 10 kg per pcs
Operation: at least 2 people
Anti-corrosion Tape Wrapping Machine
Wrapping Machines, Hand Applied Wrapp Machine, Anti-corrosion Tape Wrapping Machine
Jining Xunda Pipe Coating Materials Co.,Ltd , http://www.pipe-wrap.com